Seco: tantissime le novità presentate ad Embedded World 2018

Fondata nel 1979, SECO è una società leader nelle soluzioni elettroniche embedded. Offre soluzioni modulari complete basate su fattori ampiamente riconosciuti (Qseven®, COM Express ™, ETX® e SMARC), computer a scheda singola, sistemi e soluzioni personalizzate. Produce interamente in Italia e opera in tutto il mondo con una distribuzione globale e uffici in Germania, Stati Uniti, India e Taiwan.

Come ogni anno, la SECO sarà a Norimberga (Germania) per la fiera annuale Embedded World. L’evento 2018 ha preso il via lo scorso 27 febbraio e si conclude oggi 1 marzo. SECO nel corso della manifestazione ha presentato le sue soluzioni allo stand 1.441 (stand principale SECO) e 4.539 (stand SECO Lab, la business unit orientata all’educazione).

Tra le grandi innovazioni di quest’anno, il lancio di COMe-B75-CT6: è un modulo COM Express ™ Compact 3.0 Type 6 con niente di meno che i processori AMD Ryzen ™ Embedded V1000. Il modulo monta fino a 4 core CPU Zen x86 con la più recente grafica Radeon ™ e controller I / O su un singolo chip. Ideale per dispositivi medici, segnaletica digitale, infotainment e giochi, sarà esposto anche presso lo stand di Keysight Technologies.

Founded in 1979, SECO is a leading company in electronic embedded solutions. It offers complete modular solutions built on widely recognised standard off-the-shelf form factors (Qseven^®, COM Express™, ETX^® and SMARC), Single-Board Computers, systems and custom solutions. It entirely produces in-house in Italy and operates worldwide with a global distribution and offices in Germany, USA, India and Taiwan.

As every year, SECO will be in Nuremberg (Germany) for the annual Embedded World trade fair. The 2018 event is held from the February 27th to March 1st, where SECO will be showcasing its solutions at booth 1.441 (SECO main booth), and 4.539 (SECO Lab booth, the education-oriented business unit).

Among the great innovations of this year, the launch of COMe-B75-CT6: it is a COM Express™ Compact 3.0 Type 6 Module with nothing less than the AMD Ryzen™ Embedded V1000 processors. The module mounts up to 4 Zen x86 CPU cores with the latest Radeon™ graphics and I/O controller on a single chip. Ideal for medical devices, digital signage, infotainment, and gaming, it will also be exposed at Keysight Technologies’ booth.

Speaking of Intel^®-based solutions, the vast array of solutions based on Intel^® Atom™ E39xx family, Intel^® Celeron^® N3350 and Intel^® Pentium^® N4200 (c.n. Apollo Lake) SoCs will be exposed: first and foremost, the SM-B69, a high-performance, low-power, feature-rich SMARC Rel. 2.0 compliant module with 4K HW decoding and encoding, and the SBC-B68-eNUC, an industrial x86 embedded NUC™ SBC perfect for HMI, multimedia devices, IIoT, and industrial automation.

SECO is a member of the exclusive NXP i.MX 8 early access program. The SM-C12, a SMARC Rel. 2.0 compliant module with NXP i.MX 8M Application Processors, is a scalable solution designed by SECO for home automation, transportation, digital signage and vending machines, and applicable to scenarios requiring advanced security, connectivity, multimedia and real-time response. The new Qseven^® modules based on NXP i.MX 8M (Q7-C25) and NXP i.MX 8 Application Processors (Q7-C26) will also be presented.

Speaking of other NXP-based solutions, one of the great innovations of this year at SECO booth is the new Smart Edge Compute Unit SYS-C23-GW. This industrial IoT multiprotocol gateway, based on NXP i.MX 6SoloX Processor, is a cloud connectivity ready solution, which enables multi-core edge computing and networking. When it comes to connectivity, thanks to the partnerships with Telenor Connexion and Quectel, the board is plentiful, offering 2G/4G, WiFi, BLE/2x Ethernet and SubGiga.

Another innovative achievement in the SECO’s Boxed Solutions product family is the SYS-A90-IPC, a Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon). Designed for high-level graphics performance, it offers three independent heads with UltraHD 4K resolution and h.264/h.265 4K hardware.
Back to the ARM-solutions topic, SM-B71, a SMARC Rel. 2.0 compliant module with the Xilinx^® Zynq^® Ultrascale+™ MPSoC, will also be featured at SECO’s booth: this product merges ARM and FPGA into a heterogeneous, standard form factor, combining wide scalability, high flexibility, and dedicated Real-Time ARM^® Cortex^®-R5 processors.

Also, the new carrier board CCOMe-C30 will be presented: a digital signage-oriented Carrier Board for COM Express™ Type 6 Modules on 3.5” form factor, offering a wide range of I/Os, multi-display applications and connectivity options.

At SECO Lab, the UDOO team will showcase the UDOO family of Open Source Arduino-powered Mini PCs, including UDOO X86, worldwide acclaimed as “the most powerful maker board ever”. The UDOO team will also demo for the first time its most impressive innovation so far: UDOO IoT Cloud, a web cloud platform designed for IoT, rapid prototyping, and home automation. Different from other platforms, UDOO IoT Cloud stands out for ease of use thanks to the seamless integration with all the UDOO devices as well as with the upcoming UDOO Grove Kit and App Inventor, which ultimately simplifies programming.

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